Advanced Packaging provides a unique perspective on the design and fabrication of advanced electronic component packaging. The magazine's technology-specific coverage focuses on the engineering drive for smaller, faster, more reliable and cost-effective packaging solutions.

News & resources for engineers involved in microelectronics packaging materials & technologies.

Advanced Packaging serves those in operations that integrate electronic component packages into circuitry of their end products. Advanced Packaging magazine debuted in 1992 to the IC packaging engineering community.

Each issue of Advanced Packaging highlights an important step in the IC packaging process, including wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping, package inspection, package test, and laser marking, singulation, packing and shipping. Each step implements the latest trends and technologies, and is written by a leading IC packaging expert in the given field.

Advanced Packaging's editorial topics include CSP, flip chip, MCM, BGA, Microwave/RF, thermal management, wafer-level packaging, system-on-a-chip, s oldering, wire bonding, direct chip attach, die placement, substrates, KGD, thick/thin film, inspection and test, adhesives and epoxies/underfill, environmental packaging, COB and TAB. Regular magazine departments focus on step-by-step advanced packaging, partners in manufacturing, market trends, feature products and event coverage.

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Geographic Eligibility: USA (Print and Digital editions), Selected International (Digital edition only)

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Magazine delivers microelectronics news and technology for engineers involved with semiconductors, integrated circuits, assembly, wafer dicing, die placement, Advanced Imaging, wire bonding, encapsulation and package inspection.

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