Printed Circuit Design & Fab provides a forum to enable design and manufacturing managers, executives and their suppliers to understand and implement techniques, methodologies, processes and technologies that compliment and improve competitiveness in the electronic interconnect industry.

Printed Circuit Design & Fab is the result of the fusion of PC FAB and Printed Circuit Design magazines. The lines between design and manufacturing continue to blur and communication between these two areas is critical for product success. For this reason, UP Media Group made the decision to combine these two leading brands into one dynamic product.

The entire, unduplicated subscriber bases from both PC FAB’s and Printed Circuit Design’s subscription files were used to create the 37,300 circulation database of PCD&M. Likewise, the editorial product combines the best of both disciplines and, for the first time, provides experts in the electronic interconnect industry with one resource for all of their technical and market needs. The first issue of Printed Circuit Design & Fab premiered in April 2003.

Printed Circuit Design & Fab’s editorial coverage is determined by working members of the PCB design industry - professionals who face the same problems as you do on a daily basis. These editorial review board members help develop Printed Circuit Design & Fab's editorial content for each year, as well as review and contribute articles to the magazine.

View Printed Circuit Design & Fab, August 2008

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FEATURES:

Global Enterprise
Product Development Challenges in a Global Market
Leveraging globalization allows electronics companies to meet business goals of improved time-to-market and lower development costs.
by John Isaac

Co-Design
Innovative Modeling Supports Co-Design of the Power Supply Chain, Parts 1 and 2
Note: Part 1 was published in July. Part 2 was published in August. Both parts are included here.
New software tools ease problems associated with power delivery design in large computer systems.
by David Quint and Charles Keen

Microwave Laminate
Low-Loss Fluoropolymer Copper Clad Laminate
Improved evaluation methods clarify dielectric loss, including conductor loss and roughness loss on copper-clad laminate materials.
by Kazuhiko Niwano, Manuel Reyes, Mitsufumi Ono and Koji Ikawa

Outsourcing
Qualifying PCBs Outsourced in Asia
Communication, documentation and teamwork between suppliers reduces the risk and increases the benefits of outsourcing.
by Mumtaz Y. Bora

Plating
Copper Plating and Microvia Fill for Advanced PCBs
Vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires copper plated microvia fill.
by Bruce Chen

Trade Shows
The 2008 JPCA Review
Shrinking lines, spaces and vias make LDI, laser drilling, inkjet and buried components the technologies to watch.
by Dr. Hayao Nakahara

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Report: MEMS Switching Market to Top $700 million By 2012
LYON, FRANCE -- According to Yole Developpement, the MEMS switch and varicaps markets will reach $700 million in sales by 2012. Growth is driven by handset applications.

Report: China Electronics Revenues to Reach $100B in 2009
NUREMBERG and ARLINGTON, VA  – Consumer electronics revenues in China are forecast to reach $100 billion by 2009, surpassing Western Europe and North America between 2009 and 2010, say market researcher GfK and the Consumer Electronics Association.

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