Printed Circuit Design & Fab provides a forum to enable design and manufacturing managers, executives and their suppliers to understand and implement techniques, methodologies, processes and technologies that compliment and improve competitiveness in the electronic interconnect industry.

Printed Circuit Design & Fab is the result of the fusion of PC FAB and Printed Circuit Design magazines. The lines between design and manufacturing continue to blur and communication between these two areas is critical for product success. For this reason, UP Media Group made the decision to combine these two leading brands into one dynamic product.

The entire, unduplicated subscriber bases from both PC FAB’s and Printed Circuit Design’s subscription files were used to create the 37,300 circulation database of PCD&M. Likewise, the editorial product combines the best of both disciplines and, for the first time, provides experts in the electronic interconnect industry with one resource for all of their technical and market needs. The first issue of Printed Circuit Design & Fab premiered in April 2003.

Printed Circuit Design & Fab’s editorial coverage is determined by working members of the PCB design industry - professionals who face the same problems as you do on a daily basis. These editorial review board members help develop Printed Circuit Design & Fab's editorial content for each year, as well as review and contribute articles to the magazine.

View Printed Circuit Design & Fab, June 2008

Full & free, powered by nxtbook.

Click the "SAVE" button, you can download the entire magazine, you can also download the magazine in pdf format.

FEATURES:

DFA / DFT
Improving Design Communication Using DfA Analysis and Feedback
Creating a single data format from design through manufacturing can accelerate design data transfer, improving yields and reducing cost.
by Mark Laing

Signal Integrity
Modeling Common Ground Noise in High-Speed Multi-board
PCB Systems
The amount of noise between reference planes in two adjoining boards
depends on the inductance produced by the inter-board connector.
by Mosin Mondal, Bhyrav Mutnur, Pravin Patel, Samuel Connor,
Bruce Archambeault, and Moises Cases

From the Field
Collaborations and Conferences
At PCB East, bi-directional communication was more than a catch-phrase.
by Kathy Nargi-Toth

DFA
AOI – Defining Reliability for Complex Designs
Advanced AOI techniques provide manufacturers and OEM customers with  exceptional inspection reliability.
by Zulki Khan

Fab Basics
When a Good DOE Goes Bad
Estimate the time constant of a process prior to conducting the DOE to prevent erroneous results.
by J Lee Parker

Drill
Drilling of PCBs – an Overview
Engineering advances have increase throughput and enabled smaller via
sizes with increased process reliability.
by Todd Lizotte, Gabor Kardos and Ronald D. Schaeffer

Visit Printed Circuit Design & Fab Website

Report: MEMS Switching Market to Top $700 million By 2012
LYON, FRANCE -- According to Yole Developpement, the MEMS switch and varicaps markets will reach $700 million in sales by 2012. Growth is driven by handset applications.

Report: China Electronics Revenues to Reach $100B in 2009
NUREMBERG and ARLINGTON, VA  – Consumer electronics revenues in China are forecast to reach $100 billion by 2009, surpassing Western Europe and North America between 2009 and 2010, say market researcher GfK and the Consumer Electronics Association.

Comments (0)

Name

Email

Comment

smaller | bigger

Add Comment