Asiaing.com: Free eBooks, Free Magazines, Free Magazine Subscriptions

Saturday
Nov 07th
Text size
  • Increase font size
  • Default font size
  • Decrease font size
Home arrow Magazine Categories arrow Semiconductor International arrow Semiconductor International, May 2009

Semiconductor International, May 2009

Thursday, 11 June 2009

Semiconductor International, May 2009Semiconductor International is the world's leading monthly magazine written for manufacturers of semiconductors and integrated circuits.

Semiconductor International is a technical/business publication covering the global semiconductor manufacturing industry. It serves the needs of semiconductor engineers and suppliers through a wide range of products and services including magazines, directories, trade show guides, newsletters, specialized supplements, original research, industry seminars and awards.

Founded over 25 years ago, Semiconductor International is the leading technical publication covering the global semiconductor industry. SI has the largest circulation of qualified buyers in semiconductor fabs and foundries, features the industry's largest and most experienced full-time technical editorial staff, and carries more pages of editorial and advertising than any other industry publication.

Semiconductor International is part of Reed Elsevier, the world's largest provider of business-to-business information, and home of the world's most extensive collection of specialized electronic industry publications.

Free Subscription to Semiconductor International

Geographic Eligibility: Selected International

Offered Free by: Reed Business Information

Read the Digital Issue: Semiconductor International, May 2009

Flip-Chip Packaging Becomes Competitive

The cost and performance benefits of flip-chip packaging, combined with the increased cost of gold bonding wire, have made flip-chip technology competitive for applications ranging from cell phones to gaming chips.

Looking back 15 years ago, nearly everything was wire bonded. Today, flip-chip packaging is taking over. The basic flip-chip concept is to take a chip, place conductive bumps on the connection points, flip it over, ...

New Products
Antireflective Structures for Solar
EUV Light Source
Solar Inspection
Helium Ion Microscope
SEM/TEM
Polypropylene Piping
PV Yield Management Software
Cleanroom Contamination Analysis
Non-Destructive Hall Mobility Tester
Mask Aligners
Support for FDC
Perfluoroelastomer Seals

Visit Semiconductor International Website

As the semiconductor manufacturing industrys most comprehensive website, www.semiconductor.net is your source for breaking news, in-depth technical articles, and web-exclusive content developed by SI editors and contributors.For quick access to targeted information, our site offers focused micro-sites on key technologies.

Comments (0)add comment

Write comment
quote
bold
italicize
underline
strike
url
image
quote
quote
smaller | bigger

busy
 
< Prev   Next >

Subscribe

 Subscribe to the RSS feed. 

Email Subscription

Lots of FREE books & magazines delivered directly to your e-mail inbox!

Enter your email address:

eBooks, free eBooks
WebAsiaing.com